Product Features

1. Small overall size and many reaction chambers, providing high production efficiency and low energy consumption.
2. Optional dual RF system, with more flexible configuration and controllable cost, providing customers with more equipment configuration options.
3. Using a unified transmission platform together with independently developed CVD devices makes later maintenance more convenient and the cost is lower.
4. The coil configured with the cavity can increase the plasma concentration, making the etching rate more efficient and uniformity better.
5. The independently developed control system ensures safer and more efficient wafer transmission, so the machine parameter control is more accurate.
6. Most of domestic components greatly reduce customer maintenance costs later.

Application Fields

Mainly used for power components of third-generation semiconductors in the 5G field; can also be used for vehicle chips and communication chips.