Product Features

1. The equipment is designed with ICP concept, adopts dual RF sources, and is independently controlled in the horizontal and vertical directions of ions. The etching rate is high, and the uniformity and shape can be controlled and replaced.
2. ESC adopts the latest multi-zone and coulomb type ESC, which is safe for chuck wafers. Multi zone temperature control can more accurately control the wafer temperature and further optimize etching uniformity.
3. The interior of the cavity adopts the coating process, and the internal parts can be configured according to the customer's process,providing multiple options and lower losses.
4. The independently developed control system ensures safer and more efficient wafer transmission, so the machine parameter control is more accurate.
5. Most of domestic components greatly reduce customer maintenance costs later.

Application Fields

Mainly used for logic and storage chips, such as CPU, GPU, SoC, etc.