Product Features

1. Unique multi-layer Loadlock design, with transmission logic optimization, high production capacity, film forming process optimization, good film quality and good uniformity;
2. The operating system is a software control system developed based on Windows and conforms to semiconductor standard, which is user-friendly and in line with the operating habits of Chinese people;
3. Multi-reaction chamber design with independent gas transport system and independent temperature control heater;
4. The multi station mixed process method can meet diverse process requirements;
5. Compatible with different process requirements based on silane, TEOS, oxide film, nitride film, boron and phosphorus doping;

Application Fields

Mainly used in logic chip and FLASH, DRAM memory chip manufacturing field.